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830-Tie Point Breadboard

HW-0029

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This is a 6.5" x 2.125" 830-Tie Point solderless breadboard. It has four bus lines each spanning the length of the board, and 63 rows of pins, enough for up to nine 14 pin DIP integrated circuits (IC) or seven 16 pin DIP ICs. The rows and columns of tie points are conveniently labeled, and multiple units can be connected for larger projects.

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This is a 6.5" x 2.125" 830-Tie Point solderless breadboard. It has four bus lines each spanning the length of the board, and 63 rows of pins, enough for up to nine 14 pin DIP integrated circuits (IC) or seven 16 pin DIP ICs. The rows and columns of tie points are conveniently labeled, and multiple units can be connected for larger projects. These breadboards also have an adhesive backing like the smaller breadboards we carry.


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